详细说明：
| JCM 零件编号： |
926-DS90C401MX/NOPB |
| 制造商零件编号： |
DS90C401MX/NOPB
|
| 制造商: |
Texas Instruments
|
| 说明： |
LVDS 接口集成电路 |
| |
|
| |
PDF  数据表 |
|
|
|
|
| RoHS: |
详细信息 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
DS90C401
DS90C401 Dual Low Voltage Differential Signaling (LVDS) Driver
Literature Number: SNLS002BDS90C401
Dual Low Voltage Differential Signaling (LVDS) Driver
General Description
The DS90C401 is a dual driver device optimized for high
data rate and low power applications. This device along with
the DS90C402 provides a pair chip solution for a dual high
speed point-to-point interface. The DS90C401 is a current
mode driver allowing power dissipation to remain low even at
high frequency. In addition, the short circuit fault current is
also minimized. The device is in a 8 lead small outline
package. The differential driver outputs provides low EMI
with its low output swings typically 340 mV.
Features
n Ultra low power dissipation
n Operates above 155.5 Mbps
n Standard TIA/EIA-644
n 8 Lead SOIC Package saves space
n Low Differential Output Swing typical 340 mV
Connection Diagram
10001301
Order Number DS90C401M
See NS Package Number M08A
Functional Diagram
10001302
August 2005
DS90C401 Dual Low Voltage Differential Signaling (LVDS) Driver
© 2005 National Semiconductor Corporation DS100013 www.national.comAbsolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VCC) −0.3V to +6V
Input Voltage (DIN) −0.3V to (VCC + 0.3V)
Output Voltage (DOUT+
, DOUT−
) −0.3V to (VCC + 0.3V)
Short Circuit Duration
(DOUT+
, DOUT−
) Continuous
Maximum Package Power Dissipation @ +25˚C
M Package 1068 mW
Derate M Package 8.5 mW/˚C above +25˚C
Storage Temperature Range −65˚C to +150˚C
Lead Temperature Range
Soldering (4 sec.) +260˚C
Maximum Junction
Temperature +150˚C
ESD Rating
(HBM, 1.5 kΩ, 100 pF) ≥ 3,500V
(EIAJ, 0 Ω, 200 pF) ≥ 250V
Recommended Operating
Conditions
Min Typ Max Units
Supply Voltage (VCC) +4.5 +5.0 +5.5 V
Operating Free Air
Temperature (TA) −40 +25 +85 ˚C
Electrical Characteristics
Over supply voltage and operating temperature ranges, unless otherwise specified. (Notes 2, 3)
Symbol Parameter Conditions Pin Min Typ Max Units
VOD1 Differential Output Voltage RL
= 100Ω (Figure 1) DOUT−
,
DOUT+
250 340 450 mV
∆VOD1 Change in Magnitude of VOD1
for
Complementary Output States
4 35 |mV|
VOS Offset Voltage 1.125 1.25 1.375 V
∆VOS Change in Magnitude of VOS for
Complementary Output States
5 25 |mV|
VOH Output Voltage High RL
= 100Ω 1.41 1.60 V
VOL Output Voltage Low 0.90 1.07 V
IOS Output Short Circuit Current VOUT
= 0V (Note 8) −3.5 −5.0 mA
VIH Input Voltage High DIN 2.0 VCC V
VIL
Input Voltage Low GND 0.8 V
I
I
Input Current VIN = VCC, GND, 2.5V or 0.4V −10 ±1 +10 µA
VCL
Input Clamp Voltage ICL
= −18 mA −1.5 −0.8 V
ICC No Load Supply Current DIN = VCC or GND VCC 1.7 3.0 mA
DIN = 2.5V or 0.4V 3.5 5.5 mA
ICCL
Loaded Supply Current RL
= 100Ω All Channels
VIN = VCC or GND (all inputs)
8 14.0 mA
Switching Characteristics
VCC = +5.0V ±10%, TA = −40˚C to +85˚C (Notes 3, 4, 5, 6, 9)
Symbol Parameter Conditions Min Typ Max Units
tPHLD Differential Propagation Delay High to Low RL
= 100Ω, CL
= 5 pF
(Figure 2 and Figure 3)
0.5 2.0 3.5 ns
tPLHD Differential Propagation Delay Low to High 0.5 2.1 3.5 ns
tSKD Differential Skew |tPHLD – tPLHD| 0 80 900 ps
tSK1 Channel-to-Channel Skew (Note 4) 0 0.3 1.0 ns
tSK2 Chip to Chip Skew (Note 5) 3.0 ns
tTLH Rise Time 0.35 2.0 ns
tTHL
Fall Time 0.35 2.0 ns
DS90C401
www.national.com 2Parameter Measurement Information
Typical Application
10001304
FIGURE 1. Driver VOD and VOS Test Circuit
10001305
FIGURE 2. Driver Propagation Delay and Transition Time Test Circuit
10001306
FIGURE 3. Driver Propagation Delay and Transition Time Waveforms
10001309
FIGURE 4. Point-to-Point Application
DS90C401
3 www.national.comApplications Information
LVDS drivers and receivers are intended to be primarily used
in an uncomplicated point-to-point configuration as is shown
in Figure 4. This configuration provides a clean signaling
environment for the quick edge rates of the drivers. The
receiver is connected to the driver through a balanced media
which may be a standard twisted pair cable, a parallel pair
cable, or simply PCB traces. Typically, the characteristic
impedance of the media is in the range of 100Ω. A termination resistor of 100Ω should be selected to match the media,
and is located as close to the receiver input pins as possible.
The termination resistor converts the current sourced by the
driver into a voltage that is detected by the receiver. Other
configurations are possible such as a multi-receiver configuration, but the effects of a mid-stream connector(s), cable
stub(s), and other impedance discontinuities as well as
ground shifting, noise margin limits, and total termination
loading must be taken into account.
The DS90C401 differential line driver is a balanced current
source design. A current mode driver, generally speaking
has a high output impedance and supplies a constant current for a range of loads (a voltage mode driver on the other
hand supplies a constant voltage for a range of loads).
Current is switched through the load in one direction to
produce a logic state and in the other direction to produce
the other logic state. The typical output current is mere 3.4
mA, a minimum of 2.5 mA, and a maximum of 4.5 mA. The
current mode requires (as discussed above) that a resistive
termination be employed to terminate the signal and to complete the loop as shown in Figure 4. AC or unterminated
configurations are not allowed. The 3.4 mA loop current will
develop a differential voltage of 340 mV across the 100Ω
termination resistor which the receiver detects with a 240 mV
minimum differential noise margin neglecting resistive line
losses (driven signal minus receiver threshold (340 mV –
100 mV = 240 mV)). The signal is centered around +1.2V
(Driver Offset, VOS) with respect to ground as shown in
Figure 5. Note that the steady-state voltage (VSS) peak-topeak swing is twice the differential voltage (VOD) and is
typically 680 mV.
The current mode driver provides substantial benefits over
voltage mode drivers, such as an RS-422 driver. Its quiescent current remains relatively flat versus switching frequency. Whereas the RS-422 voltage mode driver increases
exponentially in most case between 20 MHz–50 MHz. This
is due to the overlap current that flows between the rails of
the device when the internal gates switch. Whereas the
current mode driver switches a fixed current between its
output without any substantial overlap current. This is similar
to some ECL and PECL devices, but without the heavy static
ICC requirements of the ECL/PECL designs. LVDS requires
> 80% less current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other
existing RS-422 drivers.
10001310
FIGURE 5. Driver Output Levels
DS90C401
www.national.com 4Pin Descriptions
TABLE 1. Device Pin Descriptions
Pin No. Name Description
4, 8 DIN TTL/CMOS driver input pins
3, 7 DOUT+ Non-inverting driver output pin
2, 6 DOUT−
Inverting driver output pin
5 GND Ground pin
1 VCC Positive power supply pin,
+5.0V ± 10%
Ordering Information
Operating Package Type/ Order Number
Temperature Number
−40˚C to +85˚C SOP/M08A DS90C401M
Note 1: “Absolute Maximum Ratings” are those values beyond which the
safety of the device cannot be guaranteed. They are not meant to imply that
the devices should be operated at these limits. The table of “Electrical
Characteristics” specifies conditions of device operation.
Note 2: Current into device pins is defined as positive. Current out of device
pins is defined as negative. All voltages are referenced to ground except:
VOD1 and ∆VOD1.
Note 3: All typicals are given for: VCC = +5.0V, TA = +25˚C.
Note 4: Channel-to-Channel Skew is defined as the difference between the
propagation delay of the channel and the other channels in the same chip
with an event on the inputs.
Note 5: Chip to Chip Skew is defined as the difference between the minimum and maximum specified differential propagation delays.
Note 6: Generator waveform for all tests unless otherwise specified: f = 1
MHz, ZO = 50Ω, t
r
≤ 6 ns, and t
f
≤ 6 ns.
Note 7: ESD Ratings:
HBM (1.5 kΩ, 100 pF) ≥ 3,500V
EIAJ (0Ω, 200 pF) ≥ 250V
Note 8: Output short circuit current (IOS) is specified as magnitude only,
minus sign indicates direction only.
Note 9: CL includes probe and jig capacitance.
Truth Table
DIN DOUT+ DOUT−
L L H
H H L
DIN
> 0.8V and
DIN
< 2.0V
X X
H = Logic high level
L = Logic low level
X = Indeterminant state
Typical Performance Characteristics
Power Supply Current
vs Power Supply Voltage
Power Supply Current
vs Temperature
10001311 10001312
DS90C401
5 www.national.comTypical Performance Characteristics (Continued)
Power Supply Current
vs Power Supply Voltage
Power Supply Current
vs Temperature
10001313 10001314
Output Short Circuit Current
vs Power Supply Voltage
Differential Output Voltage
vs Power Supply Voltage
10001316
10001317
DS90C401
www.national.com 6Typical Performance Characteristics (Continued)
Differential Output Voltage
vs Ambient Temperature
Output Voltage High vs
Power Supply Voltage
10001318 10001319
Output Voltage High vs
Ambient Temperature
Output Voltage Low vs
Power Supply Voltage
10001320 10001321
DS90C401
7 www.national.comTypical Performance Characteristics (Continued)
Output Voltage Low vs
Ambient Temperature
Offset Voltage vs
Power Supply Voltage
10001322 10001323
Offset Voltage vs
Ambient Temperature
Power Supply Current
vs Frequency
10001324 10001325
DS90C401
www.national.com 8Typical Performance Characteristics (Continued)
Differential Output Voltage
vs Load Resistor
Differential Propagation Delay
vs Power Supply Voltage
10001327
10001328
Differential Propagation Delay
vs Ambient Temperature
Differential Skew vs
Power Supply Voltage
10001329
10001330
DS90C401
9 www.national.comTypical Performance Characteristics (Continued)
Differential Skew vs
Ambient Temperature
Differential Transition Time
vs Power Supply Voltage
10001331
10001332
Differential Transition Time
vs Ambient Temperature
10001333
DS90C401
www.national.com 10Physical Dimensions inches (millimeters) unless otherwise noted
8-Lead (0.150" Wide) Molded Small Outline Package, JEDEC
Order Number DS90C401M
NS Package Number M08A
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.
Leadfree products are RoHS compliant.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: ap.support@nsc.com
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
DS90C401 Dual Low Voltage Differential Signaling (LVDS) DriverIMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Audio www.ti.com/audio Communications and Telecom www.ti.com/communications
Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers
Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps
DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy
DSP dsp.ti.com Industrial www.ti.com/industrial
Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical
Interface interface.ti.com Security www.ti.com/security
Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated
产品名称：【供应】DS90C401MX 集成电路
LMH6645MAX
LM2672M-1.2
DS90C401MX
