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SN74LVT18512 具有 18 位通用总线收发器的 3.3V ABT 扫描测试设备

当前价格: ¥ 0.00/PCS
最小起订:2500PCS
供货总量:10000PCS
发 货 期:1天内发货
所 在 地: 中国 
发布时间:2012-07-31

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产品介绍

SN74LVT18512 具有 18 位通用总线收发器的 3.3V ABT 扫描测试设备

The 'LVT18512 and 'LVT182512 scan test devices with 18-bit universal bus transceivers are members of the Texas Instruments SCOPETM testability integrated-circuit family. This family of devices supports IEEE Std 1149.1-1990 boundary scan to facilitate testing of complex circuit-board assemblies. Scan access to the test circuitry is accomplished via the 4-wire test access port (TAP) interface.

Additionally, these devices are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

In the normal mode, these devices are 18-bit universal bus transceivers that combine D-type latches and D-type flip-flops to allow data flow in transparent, latched, or clocked modes

  SN74LVT18512
Voltage Nodes(V) 3.3, 2.7  
Vcc range(V) 2.7 to 3.6  
Input Level TTL/CMOS  
Logic True  
No. of Outputs 18  
Output Drive(mA) -32/64  
tpd max(ns) 5.7  
Output Level LVTTL  
Static Current 16.5  
Rating Catalog  
Technology Family LVT
SN74LVT18512 特性
  • Members of the Texas Instruments SCOPETM Family of Testability Products
  • Members of the Texas Instruments WidebusTM Family
  • State-of-the-Art 3.3-V ABT Design Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • B-Port Outputs of 'LVT182512 Devices Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • Compatible With the IEEE Std 1149.1-1990 (JTAG) Test Access Port and Boundary-Scan Architecture
  • SCOPETM Instruction Set
    • IEEE Std 1149.1-1990 Required Instructions and Optional CLAMP and HIGHZ
    • Parallel-Signature Analysis at Inputs
    • Pseudo-Random Pattern Generation From Outputs
    • Sample Inputs/Toggle Outputs
    • Binary Count From Outputs
    • Device Identification
    • Even-Parity Opcodes
  • Package Options Include 64-Pin Plastic Thin Shrink Small Outline (DGG) and 64-Pin Ceramic Dual Flat (HKC) Packages Using 0.5-mm Center-to-Center Spacings
SN74LVT18512 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
74LVT18512DGGRE4 ACTIVE -40 to 85 6.60 | 1ku TSSOP (DGG) | 64 2000 | LARGE T&R  
74LVT18512DGGRG4 ACTIVE -40 to 85 6.60 | 1ku TSSOP (DGG) | 64 2000 | LARGE T&R  
SN74LVT18512DGGR ACTIVE -40 to 85 6.60 | 1ku TSSOP (DGG) | 64 2000 | LARGE T&R  
SN74LVT18512 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
74LVT18512DGGRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVT18512DGGRE4 74LVT18512DGGRE4
74LVT18512DGGRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM 74LVT18512DGGRG4 74LVT18512DGGRG4
SN74LVT18512DGGR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74LVT18512DGGR SN74LVT18512DGGR
SN74LVT18512 应用技术支持与电子电路设计开发资源下载
  1. SN74LVT18512 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器特殊逻辑产品选型与价格 . xls
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)
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