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SN74AUP2G79 低功耗单路上升沿 D 类触发器

当前价格: ¥ 0.00/PCS
最小起订:2500PCS
供货总量:10000PCS
发 货 期:1天内发货
所 在 地: 中国 
发布时间:2012-04-12

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商家等级:普通供应商

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电话:0755-83574989

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产品介绍

SN74AUP2G79 低功耗单路上升沿 D 类触发器

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

This is a single positive-edge-triggered D-type flip-flop. When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs

  SN74AUP2G79
Pin/Package 5DSBGA, 5SC70, 5SOT, 5SOT-23, 6DSBGA, 6SON
Operating Temperature Range(°C) -40 to 85  
Voltage Nodes(V) 3.3  
Logic True  
No. of Bits 1  
Static Current 0.0005  
Output Drive(mA) -4,4  
Vcc max(V) 3.6  
Technology Family AUP  
Vcc min(V) 0.8  
Approx. Price (US$) 0.13 | 1ku  
th(ns) 0  
tsu(ns) 1  
No. of Outputs 1  
Vcc range(V) 0.8 to 3.6  
tpd max(ns) 4  
ICC(uA) 0.9  
Rating Catalog
SN74AUP2G79 特性
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption: ICC = 0.9 µA Max
  • Low Dynamic-Power Consumption: Cpd = 3 pF Typ at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typ
  • Low Noise: Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial Power-Down-Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typ at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 4 ns Max at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
SN74AUP2G79 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74AUP2G79DBVR ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R  
SN74AUP2G79DBVRE4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R  
SN74AUP2G79DBVRG4 ACTIVE -40 to 85 0.13 | 1ku SOT-23 (DBV) | 5 3000 | LARGE T&R  
SN74AUP2G79DBVT ACTIVE -40 to 85 0.46 | 1ku SOT-23 (DBV) | 5 250 | SMALL T&R  
SN74AUP2G79DBVTE4 ACTIVE -40 to 85 0.46 | 1ku SOT-23 (DBV) | 5 250 | SMALL T&R  
SN74AUP2G79DBVTG4 ACTIVE -40 to 85 0.46 | 1ku SOT-23 (DBV) | 5 250 | SMALL T&R  
SN74AUP2G79DCKR ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R  
SN74AUP2G79DCKRE4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R  
SN74AUP2G79DCKRG4 ACTIVE -40 to 85 0.13 | 1ku SC70 (DCK) | 5 3000 | LARGE T&R  
SN74AUP2G79DCKT ACTIVE -40 to 85 0.46 | 1ku SC70 (DCK) | 5 250 | SMALL T&R  
SN74AUP2G79DCKTE4 ACTIVE -40 to 85 0.46 | 1ku SC70 (DCK) | 5 250 | SMALL T&R  
SN74AUP2G79DCKTG4 ACTIVE -40 to 85 0.46 | 1ku SC70 (DCK) | 5 250 | SMALL T&R  
SN74AUP2G79DRLR ACTIVE -40 to 85 0.16 | 1ku SOT (DRL) | 5 4000 | LARGE T&R  
SN74AUP2G79DRLRG4 ACTIVE -40 to 85 0.16 | 1ku SOT (DRL) | 5 4000 | LARGE T&R  
SN74AUP2G79DRYR ACTIVE -40 to 85 0.15 | 1ku SON (DRY) | 6 5000 | LARGE T&R  
SN74AUP2G79DSFR ACTIVE -40 to 85 0.14 | 1ku SON (DSF) | 6 5000 | LARGE T&R  
SN74AUP2G79YFPR ACTIVE   0.24 | 1ku DSBGA (YFF) | 6 3000 | LARGE T&R  
SN74AUP2G79YZPR ACTIVE -40 to 85 0.26 | 1ku DSBGA (YZU) | 5 3000 | LARGE T&R  
SN74AUP2G79 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74AUP2G79DBVR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DBVR SN74AUP2G79DBVR
SN74AUP2G79DBVRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DBVRE4 SN74AUP2G79DBVRE4
SN74AUP2G79DBVRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DBVRG4 SN74AUP2G79DBVRG4
SN74AUP2G79DBVT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DBVT SN74AUP2G79DBVT
SN74AUP2G79DBVTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DBVTE4 SN74AUP2G79DBVTE4
SN74AUP2G79DBVTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DBVTG4 SN74AUP2G79DBVTG4
SN74AUP2G79DCKR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DCKR SN74AUP2G79DCKR
SN74AUP2G79DCKRE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DCKRE4 SN74AUP2G79DCKRE4
SN74AUP2G79DCKRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DCKRG4 SN74AUP2G79DCKRG4
SN74AUP2G79DCKT Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DCKT SN74AUP2G79DCKT
SN74AUP2G79DCKTE4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DCKTE4 SN74AUP2G79DCKTE4
SN74AUP2G79DCKTG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DCKTG4 SN74AUP2G79DCKTG4
SN74AUP2G79DRLR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DRLR SN74AUP2G79DRLR
SN74AUP2G79DRLRG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DRLRG4 SN74AUP2G79DRLRG4
SN74AUP2G79DRYR Green (RoHS & no Sb/Br)  NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DRYR SN74AUP2G79DRYR
SN74AUP2G79DSFR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP2G79DSFR SN74AUP2G79DSFR
SN74AUP2G79YFPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP2G79YFPR SN74AUP2G79YFPR
SN74AUP2G79YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP2G79YZPR SN74AUP2G79YZPR
SN74AUP2G79 应用技术支持与电子电路设计开发资源下载
  1. SN74AUP2G79 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)
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