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SN74AUP1G74 低功耗单路上升沿 D 类触发器

当前价格: ¥ 0.00/PCS
最小起订:2500PCS
供货总量:10000PCS
发 货 期:1天内发货
所 在 地: 中国 
发布时间:2012-04-12

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电话:0755-83574989

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产品介绍

SN74AUP1G74 低功耗单路上升沿 D 类触发器

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

This single positive-edge-triggered D-type flip-flop is designed for 0.8-V to 3.6-V VCC operation.

A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs. To better optimize the flip-flop for higher frequencies, the CLR input overrides the PRE input when they are both low.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down

  SN74AUP1G74
Pin/Package 8DSBGA, 8UQFN, 8US8, 8X2SON  
Operating Temperature Range(°C) -40 to 85  
IOL(mA) 4  
IOH(mA) -4  
Vcc max(V) 3.6  
Technology Family AUP  
Vcc min(V) 0.8  
Approx. Price (US$) 0.28 | 1ku  
th(ns) 0  
tsu(ns) 0.5  
Vcc range(V) -0.5 to 4.6  
tpd max(ns) 2  
ICC(uA) 0.9  
Rating Catalog
SN74AUP1G74 特性
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption: ICC = 0.9 µA Max
  • Low Dynamic-Power Consumption: Cpd = 5.5 pF Typ at 3.3 V
  • Low Input Capacitance: Ci = 1.5 pF Typ
  • Low Noise – Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Schmitt-Trigger Action Allows Slow Input Transition and Better Switching Noise Immunity at the Input (Vhys = 250 mV Typ at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5 ns Max at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
SN74AUP1G74 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74AUP1G74DCUR ACTIVE -40 to 85 0.29 | 1ku US8 (DCU) | 8 3000 | LARGE T&R  
SN74AUP1G74DCURG4 ACTIVE -40 to 85 0.29 | 1ku US8 (DCU) | 8 3000 | LARGE T&R  
SN74AUP1G74DQER ACTIVE -40 to 85 0.28 | 1ku X2SON (DQE) | 8 5000 | LARGE T&R  
SN74AUP1G74RSER ACTIVE -40 to 85 0.29 | 1ku UQFN (RSE) | 8 5000 | LARGE T&R  
SN74AUP1G74YFPR ACTIVE -40 to 85 0.37 | 1ku DSBGA (YZD) | 8 3000 | LARGE T&R  
SN74AUP1G74YZPR ACTIVE -40 to 85 0.40 | 1ku DSBGA (YZD) | 8 3000 | LARGE T&R  
SN74AUP1G74 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74AUP1G74DCUR Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G74DCUR SN74AUP1G74DCUR
SN74AUP1G74DCURG4 Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G74DCURG4 SN74AUP1G74DCURG4
SN74AUP1G74DQER Green (RoHS & no Sb/Br)  NIPDAU  Level-1-260C-UNLIM SN74AUP1G74DQER SN74AUP1G74DQER
SN74AUP1G74RSER Green (RoHS & no Sb/Br)  CU NIPDAU  Level-1-260C-UNLIM SN74AUP1G74RSER SN74AUP1G74RSER
SN74AUP1G74YFPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP1G74YFPR SN74AUP1G74YFPR
SN74AUP1G74YZPR Green (RoHS & no Sb/Br)  SNAGCU  Level-1-260C-UNLIM SN74AUP1G74YZPR SN74AUP1G74YZPR
SN74AUP1G74 应用技术支持与电子电路设计开发资源下载
  1. SN74AUP1G74 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)
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