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| 标题： | 用于在恶劣环境中使用的电源电子设计的可回流热保护解决方案（英语） | ||
| 类型： | 技术文档 | 大小： | 1790760KB |
| 语言： | 英文 | 发布时间： | 2015-06-12 |
| 文档介绍： |  |
| The RTP device described in this overview can withstand the demanding environmental, life, and reliability requirements of automotive and industrial applications, including shock, vibration, temperature cycling, and humidity exposures. In the field, the RTP device opens if its internal junction exceeds the device’s specified open temperature. Temperature increases can have multiple sources, one of which is component failure (i.e. when using power components such as a power FET, capacitor, resistor, triac, etc.). The RTP device open temperature is selected so that the device does not open within normal component operating windows, but it does open in a thermal runaway event and before the melt temperature of typical lead free solders | |